INVENTEC Solder Paste ECOREL™ FREE 305-31A
More than 2 decades of experience in high reliability markets such as automotive, energy and aerospace. For our
customers, having the correct choice of materials certainly contributes to increase in long term performance and to drop in
maintenance costs.
*
Key additional value:
The reliability of electrochemical corrosion (ECM) passes the "BONO test" (key technical parameter), which can monitor whether chemical residues remain inert after welding; The product is compatible with most three-proof paints on the market.
|
PERFORMANCE |
·
Low
voiding to achieve consistent bond line thickness ·
Very
good wetting on copper surfaces ·
Low
post-reflow residues |
|
COST |
·
Minimized
copper oxidation for higher first-pass yield ·
Minimized
risks for wire bonding defects |
|
HSE |
·
No
halogen ·
Lead
free |
Developed with the reliable chemistry of
the ECORELTM range.
It is designed for Die Attach
on DCB modules for IGBT’s and power electronics devices such as inverters and converters.
* Features
|
SPECIFICATIONS |
ECOREL FREE
305-31A |
|
Alloy |
Sn96,5Ag3Cu0,5 |
|
Melting
point (oC/oF) |
217 / 422 |
|
Metal
content (%) |
89 +/- 0.5 |
|
Post
reflow residues |
Approximately 5% by w/w |
|
Halogen
content |
No Halogen |
|
Powder
size |
25 – 45 microns / Type 3 |
|
Spiral
pump* Viscosity (Pa.s 25oC) |
Typical 145 |
* Characteristics
|
CHARACTERISTICS |
VALUES |
|
|
Flux
Classsification |
ROLO |
ANSI/J-STD-004 |
|
113 |
ISO 9454 |
|
|
Solder
balling test |
Pass |
ANSI/J-STD-005 |
|
Copper
corrosion |
Pass |
ANSI/J-STD-004 |
|
SIR
(IPC) |
Pass |
ANSI/J-STD-004 |
|
SIR
(Bellcore) |
Pass |
Bellcore |
|
Electromigration
(IPC / Bellcore) |
Pass |
ANSI/J-STD-004 / Bellcore |
|
Bono
Corrosion test (85%HR – 15 days |
Pass Corrosion Factor <8% |
Inventec procedure |