INVENTEC Solder Paste ECOREL™ FREE 305-16LVD
* Benefits
No clean, lead-free solder paste developed with the reliable chemistry of the ECOREL™ range. Passed BONO Test.
|
PERFORMANCE |
·
Low
voiding to offer great heat dissipation ·
Very
good wetting on all surface finishes, including OSP ·
Transparent
colorless residue, even after multiple reflow cycles |
|
COST |
·
Good
first pass yield testability in ICT ·
Increase
lifetime and reliability of your product, hence reduces risk of premature
failures. |
|
HSE |
·
No
halogen ·
Lead
free |
* Features
STANDARD OPTIONS
|
SPECIFICATIONS |
ECOREL 305-16LVD
88.0T4 |
ECOREL 305-16LVD
88.5T4 |
ECOREL 305-16LVD
88.5T5 |
|
Alloy |
Sn96,5Ag3Cu0,5 |
Sn96,5Ag3Cu0,5 |
Sn96,5Ag3Cu0,5 |
|
Melting
point (oC/oF) |
217 / 422 |
217 / 422 |
217 / 422 |
|
Metal
content (%) |
88 |
88.5 |
88.5 |
|
Post
reflow residues |
Approximately 5% by w/w |
Approximately 5% by w/w |
Approximately 5% by w/w |
|
Halogen
content |
No Halogen |
No Halogen |
No Halogen |
|
Powder
size |
20 – 38 microns / Type 4 |
20 – 38 microns / Type 4 |
15-25 microns / Type 5 |
|
Spiral
pump* Viscosity (Pa.s 25oC) |
Typical 135 |
Typical 135 |
Typical 155 |
*The
equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation
speed.
DISPENSING OPTIONS
|
SPECIFICATIONS |
ECOREL 305-16LVD
85.0T5 |
|
Alloy |
Sn96,5Ag3Cu0,5 |
|
Melting
point (oC/oF) |
217 / 422 |
|
Metal
content (%) |
85 |
|
Post
reflow residues |
Approximately 5% by w/w |
|
Halogen
content |
No Halogen |
|
Powder
size |
15 – 25 microns / Type 5 |
|
Spiral
pump* Viscosity (Pa.s 25oC) |
Typical 65 |