INVENTEC Solder Paste ECOREL™ FREE 305-31A (JAR 500g/Cartridge 600g)

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  • Product Code: ECOREL™ 305-31A


INVENTEC Solder Paste ECOREL FREE 305-31A

More than 2 decades of experience in high reliability markets such as automotive, energy and aerospace. For our customers, having the correct choice of materials certainly contributes to increase in long term performance and to drop in maintenance costs.

* Key additional value:

The reliability of electrochemical corrosion (ECM) passes the "BONO test" (key technical parameter), which can monitor whether chemical residues remain inert after welding; The product is compatible with most three-proof paints on the market.

 

PERFORMANCE

·        Low voiding to achieve consistent bond line thickness

·        Very good wetting on copper surfaces

·        Low post-reflow residues

COST

·        Minimized copper oxidation for higher first-pass yield

·        Minimized risks for wire bonding defects

HSE

·        No halogen

·        Lead free

Developed with the reliable chemistry of the ECORELTM range. It is designed for Die Attach on DCB modules for IGBT’s and power electronics devices such as inverters and converters.

* Features

SPECIFICATIONS

ECOREL FREE 305-31A

Alloy

Sn96,5Ag3Cu0,5

Melting point (oC/oF)

217 / 422

Metal content (%)

89 +/- 0.5

Post reflow residues

Approximately 5% by w/w

Halogen content

No Halogen

Powder size

25 – 45 microns / Type 3

Spiral pump* Viscosity (Pa.s 25oC)

Typical 145

* Characteristics

CHARACTERISTICS

VALUES

 

Flux Classsification

ROLO

ANSI/J-STD-004

113

ISO 9454

Solder balling test

Pass

ANSI/J-STD-005

Copper corrosion

Pass

ANSI/J-STD-004

SIR (IPC)

Pass

ANSI/J-STD-004

SIR (Bellcore)

Pass

Bellcore

Electromigration (IPC / Bellcore)

Pass

ANSI/J-STD-004 / Bellcore

Bono Corrosion test (85%HR – 15 days

Pass Corrosion Factor <8%

Inventec procedure