INVENTEC Solder Paste ECOREL™ HT 296T-85
High Temperature, halogen free, die attach solder paste in syringe packaging
* Features
- High lead content (Pb92.5Sn5Ag2.5) designed and formulated for the die-attach process in power semiconductors and high temperature assembly of micromodules and embedded systems
- No clean
- Excellent flux residue cleanability
- Excellent abandon time, and long steady tackiness
- Good wettability on Ni, NiP, and Cu lead frames